Job Description

**Job Summary:

**

As a Senior Microelectronic Assembler, you will perform a variety of electronic assembly operations on assemblies or subassemblies. Determines and/or follows methods and sequence of operations in performing wire bonding on assembly units. Make setups and adjustments holding tolerances to drawing specifications. Perform the various tasks necessary to assemble or rework electronic assemblies for production. This includes the documentation necessary to track the traveler and the assembler's performance.

**Job Responsibility:

**

• Die attach and Wire bonding Die level components from work Instructions and assembly drawings
• Manipulation of items using a variety of tools while using a microscope
• Maintain logs and paperwork and forms accurately
• Operates and troubleshoots production line equipment and computers
• Must continuously meet/exceed production schedules and deadlines according to quality standards
• Self-monitoring of workmanship
• Understand and follow all safety requirements, as well as ISO Practices and Procedures
• Other duties as assigned

**Required Qualification:

**

• 10+ Years of work experience

• Experience with Hybond or Westbond or equivalent wire bonders

• Experience with 0.7 and 0.8 mil gold wire and 2-3 gold mil ribbon bonds

• Experience with Substrate and Die attach with Silver Epoxy

• Experience performing detailed work under a microscope

• Follow detailed written and verbal instructions

• Problem solving skills

• Enthusiastic, cooperative, and positive behavior

**Preferred Qualification:

**

• Microelectronics Assembly skills, including the ability to recognize non-conformities
• Ability to multi-task and work in a flexible and changing environment with multiple competing deadlines
• ESD knowledgeable

This position requires you to access information that is subject to U.S. export regulations. You may only access such information if you are a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. government."

You should be proficient in:

• Die Attach/Bonding
• Electrical Schematics
• Mechanical Assembly Skills
• High School / GED

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